This solicitation closed on September 23, 2026
View current Department of Defense opportunities →Cable Connector Enhancement
AI Overview
This RFP seeks an enhanced cable connector solution to address common failure points in electronics systems exposed to thermal and mechanical stress. The solution must overcome limitations of current potting, rework, and alternative joining methods while remaining practical for existing designs and densely populated boards.
This summary is AI-generated from the official solicitation.
Key Details
Official Description
It is widely known that the cable to board connection is a common failure prone interface for electronics systems due to the thermal and mechanical stress they are exposed to. For new designs this connection can be engineered such that risk is lowered as much as reasonably possible but for existing design, there are limited options to overcome the difficulty of maintaining a strong reliable electrical connection in stressful environments.
Potting PCBA and electronics assemblies offer great mois...
Change History
Informational change · Status
Cable Connector Enhancement
Status changed from status: Open to status: Closed.
Cable Connector Enhancement
Q1 was significantly expanded with 10 detailed sub-questions and answers clarifying: full submersion encapsulation allowed, permanent joints acceptable, connector-specific inserts less desirable than broad solutions, no specific connector series required, signal quality (not quantified) is the electrical criterion, all three potting chemistries acceptable (epoxy primary), analysis required with testing desired, simple reusable installation aids permitted, no government-furnished boards, and success defined by compatibility with outlined testing and potting/submersion assembly.
Cable Connector Enhancement
Q&A Changes Summary
New Answer Added:
- A3 now clarifies that connector demateability is not required after potting—permanent mated joints are acceptable. The connector does not need to separate once mated.
Clarification Added:
- A2 explains that the duplicated "Be compatible with the following connector types at minimum:" line refers to the MMCX, SMA, UFL, Panasonic, and Samtec list mentioned earlier (resolving an apparent omission).
No Changes:
- A4 remains unchanged, maintaining that permanent joints are acceptable, RF specs are application-dependent with no exact values provided, Panasonic/Samtec are part families, connector-specific form factors with common processes are acceptable, and no strain/retention targets are specified beyond MIL tests.
Cable Connector Enhancement
Added 7 new detailed questions (Q1-Q3 expanded format) covering: full submersion with potting exclusion from contacts, demateability post-potting, multiform-factor platforms, specific connector series identification, electrical acceptance criteria for SMA/MMCX/U.FL, potting chemistry options, Phase I prototype vs. analysis requirements, installation aid restrictions, government-furnished materials, success metrics, and missing connector list clarification. Q4 reiterates previous answers without new information.
Cable Connector Enhancement
All 5 existing questions received answers. Key clarifications: permanent joints acceptable; RF specs application-dependent (no exact limits); Panasonic/Samtec are part families; single method preferred but connector-specific variants with common process acceptable; strain/retention targets not yet specified.
Cable Connector Enhancement
This Q&A clarifies technical specifications applicants must address: demateability preferences, RF performance metrics (frequency ranges, insertion/return loss tolerances), specific connector part numbers/families, connector standardization requirements, and quantified mechanical performance targets (strain, retention, pull-out force) beyond baseline MIL standards.
Cable Connector Enhancement
Status changed from Pre-Release to Open
Cable Connector Enhancement
New opportunity: Cable Connector Enhancement
Similar Opportunities
Agile Wire Harness Manipulation and Installation for Unmanned Aerial Systems
Due November 25, 2026
Pre-ReleaseInput-Output Unit (IOU) for Secure Processing and Routing of Hull, Mechanical, & Electrical (HM&E) and Navigation Signals
Due November 25, 2026
Pre-ReleaseOptimally Packaged Assembly for Laser Systems (OPALS)
Due November 25, 2026
Get Alerts for Opportunities Like This
RallyProp monitors thousands of funding sources and sends instant alerts when opportunities match your technology and capabilities.
Start Free Trial