Spreaders for Microsystems with Advanced Thermal Resilience (SMART)

Name: Spreaders for Microsystems with Advanced Thermal Resilience (SMART)
Creator: Department of Defense
Published: 2026-05-06T12:52:52.097765+00:00
Keywords: SBIR

Department of DefenseDARPA

AI Overview

DARPA seeks thin-film heat spreader technology for high-power microsystems operating in extreme conditions. The innovation must manage heat dissipation in semiconductor lasers and high-temperature electronics while remaining thermally conductive, electrically insulating, and compatible with existing manufacturing processes.

This summary is AI-generated from the official solicitation.

Key Details

Agency

Department of Defense

Funding Amount

—

Release Date

May 6, 2026

Due Date

June 24, 2026 (Closed)

Official Description

The Defense Advanced Research Projects Agency (DARPA) is soliciting innovative proposals for the research and development of thin-film heat spreader technology.

Current heat spreader solutions use high thermal conductivity (TC) materials like copper (TC: 400 W/m·K) and aluminum nitride (TC: 320 W/m·K). However, these solutions lack the complete set of properties needed to make them both effective at heat spreading and survivable in extreme environments. The ultimate thin-film heat spreader m...

View on official source

Change History

Opportunity RemovedJun 24, 2026 at 4:02 PM