OSW26BZ04-DV007Pre-ReleaseSBIR

Integrated Multicomponent Module for Quantum Sensors

Department of DefenseOSD

AI Overview

This RFP seeks integrated quantum sensor components with minimal size, weight, and power requirements for vehicle and platform deployment. The effort aims to transition custom quantum sensing solutions toward standardized, commercially viable COTS components that reduce costs and expand dual-use market applications.

This summary is AI-generated from the official solicitation.

Key Details

Agency
Department of Defense
Funding Amount
Release Date
July 1, 2026
Due Date
August 19, 2026

Official Description

The DoW needs quantum sensing capabilities that are Size, Weight, and Power (SWaP) compatible with a broad range of vehicles and platforms, and it seeks to develop commercial, off-the-shelf (COTS) components with integrated capabilities that currently hinder low-SWAP quantum sensors. Such COTS components could provide multiple advantages:

Integrating capability for use in different sensor designs across the quantum industry Accelerating the development of low SWaP, low-cost quantum sensors by f...

View on official source

Change History

Description ChangedJul 3, 2026 at 3:03 PM

Integrated Multicomponent Module for Quantum Sensors

**Minor editorial changes only.** The content is substantively identical—the bullet points were simply reformatted from paragraph style to a vertical list format for improved readability. No requirements, scope, technical focus, budget, timeline, or eligibility criteria were modified.

Opportunity AddedJul 1, 2026 at 12:02 PM

Integrated Multicomponent Module for Quantum Sensors

New opportunity: Integrated Multicomponent Module for Quantum Sensors

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