This solicitation closed on March 17, 2026

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Electronics / Sensors

DEPT OF THE ARMYDEPT OF DEFENSE.DEPT OF THE ARMY.AMC.ACC.ACC-CTRS.ACC-NJ.W6QK ACC-PICA

AI Overview

Electronics and sensors R&D covering MEMS devices via DRIE, anti-tamper systems, advanced distributed sensors (radar, electro-optics, infrared), and autonomous munitions behaviors.

This summary is AI-generated from the official solicitation.

Key Details

Agency
DEPT OF THE ARMY
Funding Amount
—
Release Date
December 16, 2025
Due Date
March 17, 2026 (Closed)

Official Description

Development of micro-system chips using DRIE process for MEMS devices, anti-tamper systems for remote armament, advanced distributed sensors (radar, electro-optics, infrared), and non-kinetic effects capabilities. Includes miniaturization of electronic components, fire control sensors, and collaborative autonomous behaviors for munitions.

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