This solicitation closed on July 27, 2022
View current Department of Defense opportunities →Co-Packaged Analog-Drive High-Bandwidth Optical Input/Output (KANAGAWA)
AI Overview
DoD seeks to mature co-packaged optics technology, laser sources, and advanced packaging techniques for prototype demonstration. This effort aims to transition cutting-edge microelectronics capabilities into defense systems and strengthen the industrial supply chain.
This summary is AI-generated from the official solicitation.
Key Details
Official Description
Thank you for your interest in this opportunity which is now closed. Please note that documentation pertaining to this project is no longer available. S²MARTS PROJECT NO. 22-13: The Office of the Undersecretary of Defense, Research & Engineering (OUSD(R&E)) Trusted & Assured Microelectronics (T&AM) program is seeking to mature co-packaged optics (CPO), laser sources, and associated advanced packaging techniques for prototype demonstration and technology transition into the DoD advanced packaging...
Change History
Co-Packaged Analog-Drive High-Bandwidth Optical Input/Output (KANAGAWA)
New opportunity: Co-Packaged Analog-Drive High-Bandwidth Optical Input/Output (KANAGAWA)
Similar Opportunities
Secure Packaged Microelectronic Components, Printed Circuit Boards, and Supporting Technologies
Due September 16, 2026
ActiveCo-packaging Digital Readout Integrated Circuits and Photonics for Advanced Infrared Imaging
Due September 23, 2026
ActiveResearch and Development (R&D) for Next Generation Aircraft Protection Technologies
Due November 23, 2030
Get Alerts for Opportunities Like This
RallyProp monitors thousands of funding sources and sends instant alerts when opportunities match your technology and capabilities.
Start Free Trial