ActiveRFI

Secure Packaged Microelectronic Components, Printed Circuit Boards, and Supporting Technologies

Name: Secure Packaged Microelectronic Components, Printed Circuit Boards, and Supporting Technologies
Creator: DEPT OF THE ARMY
Published: 2026-08-17T00:00:00+00:00
Keywords: RFI

DEPT OF THE ARMYDEPT OF DEFENSE.DEPT OF THE ARMY

AI Overview

Army RFI for secure packaged microelectronic components, printed circuit boards, and supporting technologies. Market research identifies potential sources for trusted microelectronics solutions.

This summary is AI-generated from the official solicitation.

Key Details

Agency

DEPT OF THE ARMY

Funding Amount

—

Release Date

August 17, 2026

Due Date

September 16, 2026

Official Description

Refer to the Attachment, R2.0_SS_RFI_SUBMISSION_v1.2.

⚠️ Note: The SAM.gov API does not provide detailed information for this opportunity. Full details may be available in attached documents or by contacting the point of contact directly.

View on official source

Change History

Opportunity AddedAug 17, 2026 at 9:03 PM