3D-Heterogeneously Integrated Photonic (HIP) Imaging Sensor
This RFP seeks development of 3D heterogeneously integrated photonic imaging sensors that stack detector, readout electronics, and optical interconnect layers to overcome copper bandwidth limitations in advanced military EO/IR focal plane arrays. The solution enables concurrent wide field-of-view, high resolution, and ultra-high frame rate imaging through innovative vertical integration and cryogenic-compatible design.