Spreaders for Microsystems with Advanced Thermal Resilience (SMART)
AI Overview
DARPA seeks thin-film heat spreader technology for high-power microsystems operating in extreme conditions. The innovation must manage heat dissipation in semiconductor lasers and high-temperature electronics while remaining thermally conductive, electrically insulating, and compatible with existing manufacturing processes.
This summary is AI-generated from the official solicitation.
Key Details
Official Description
The Defense Advanced Research Projects Agency (DARPA) is soliciting innovative proposals for the research and development of thin-film heat spreader technology.
Current heat spreader solutions use high thermal conductivity (TC) materials like copper (TC: 400 W/m·K) and aluminum nitride (TC: 320 W/m·K). However, these solutions lack the complete set of properties needed to make them both effective at heat spreading and survivable in extreme environments. The ultimate thin-film heat spreader m...
Change History
Spreaders for Microsystems with Advanced Thermal Resilience (SMART)
Status changed from Pre-Release to Open
Spreaders for Microsystems with Advanced Thermal Resilience (SMART)
New opportunity: Spreaders for Microsystems with Advanced Thermal Resilience (SMART)
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