ClosedOTA

Strategic Transition of Microelectronics to Accelerate Modernization by Prototyping and Innovating in the Packaging Ecosystem (STEAM PIPE)

Department of DefenseNSTXL

AI Overview

DoD seeks innovative microelectronics packaging solutions through chiplet prototype development to modernize military systems. The STEAM PIPE program targets design, fabrication, and testing of advanced packaging ecosystems for next-generation defense capabilities.

This summary is AI-generated from the official solicitation.

Key Details

Agency
Department of Defense
Funding Amount
Release Date
May 10, 2026
Due Date

Official Description

Thank you for your interest in this opportunity which is now closed. Please note that documentation pertaining to this project is no longer available. Not a member but interested in learning more? Fill out the form to access the opportunity documentation. During this hour-long event on 20 January, the Government team shared insights into the STEAM PIPE opportunity and answered questions from attendees. To view the event recording and slide deck, fill out the “Request To See Documents” form on th...

View on official source

Change History

Opportunity AddedMay 10, 2026 at 10:30 PM

Strategic Transition of Microelectronics to Accelerate Modernization by Prototyping and Innovating in the Packaging Ecosystem (STEAM PIPE)

New opportunity: Strategic Transition of Microelectronics to Accelerate Modernization by Prototyping and Innovating in the Packaging Ecosystem (STEAM PIPE)

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