Flexible Printed Thermoelectric Cooling Film
AI Overview
This RFP seeks development of lightweight, flexible thermoelectric cooling films using organic materials for personal and large-area applications. The solution must achieve sub-one-inch bending radius and conformal contact to curved surfaces while prioritizing flexibility and cost over efficiency for niche cooling needs.
This summary is AI-generated from the official solicitation.
Key Details
Official Description
Thermoelectric cooling devices based on narrow bandgap semiconductors such as bismuth telluride are commercially available. They are solid state devices and thus do not have the large footprint and moving parts associated with vapor compression refrigeration systems; however, they operate with lower efficiency. They are well-suited for cooling small flat surfaces where one is more concerned with the form factor than efficiency. For many practical applications, these square ceramic tile thermoele...
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