Biomanufacturing of Hierarchical Biocomposites for High-Performance Thermal Interface Materials
AI Overview
This RFP seeks biomanufactured thermal interface materials (TIMs) to improve heat dissipation in high-density electronics, drones, and battery systems. The solution must balance thermal conductivity with electrical insulation while offering cost-effective, sustainable alternatives to traditional materials.
This summary is AI-generated from the official solicitation.
Key Details
Official Description
This topic addresses the thermal management challenge to dissipate the large amount of heat generated by today’s high-density microelectronics and power storage systems to ensure and maintain performance, reliability, and safety [3, 4, 6] Thermal interface materials (TIMs) are a critical component in this thermal management. TIMs are designed to fill microgaps and surface irregularities between the otherwise bare surfaces between device and cooling system. Without a TIM, if two nominally flat an...
Change History
Biomanufacturing of Hierarchical Biocomposites for High-Performance Thermal Interface Materials
Status changed from Pre-Release to Open
Biomanufacturing of Hierarchical Biocomposites for High-Performance Thermal Interface Materials
New opportunity: Biomanufacturing of Hierarchical Biocomposites for High-Performance Thermal Interface Materials
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