DPA26TZ03-DV002Pre-ReleaseSBIR

Biomanufacturing of Hierarchical Biocomposites for High-Performance Thermal Interface Materials

Department of DefenseDARPA

AI Overview

This RFP seeks biomanufactured thermal interface materials (TIMs) to improve heat dissipation in high-density electronics, drones, and battery systems. The solution must balance thermal conductivity with electrical insulation while offering cost-effective, sustainable alternatives to traditional materials.

This summary is AI-generated from the official solicitation.

Key Details

Agency
Department of Defense
Funding Amount
Release Date
June 3, 2026
Due Date
July 22, 2026

Official Description

This topic addresses the thermal management challenge to dissipate the large amount of heat generated by today’s high-density microelectronics and power storage systems to ensure and maintain performance, reliability, and safety [3, 4, 6] Thermal interface materials (TIMs) are a critical component in this thermal management. TIMs are designed to fill microgaps and surface irregularities between the otherwise bare surfaces between device and cooling system. Without a TIM, if two nominally flat an...

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Change History

Opportunity AddedJun 3, 2026 at 12:04 PM

Biomanufacturing of Hierarchical Biocomposites for High-Performance Thermal Interface Materials

New opportunity: Biomanufacturing of Hierarchical Biocomposites for High-Performance Thermal Interface Materials

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