This solicitation closed on August 19, 2026
View current Department of Defense opportunities →Radiation Hardening of Non-Hardened Commercial Microelectronics
AI Overview
This RFP seeks advanced packaging techniques to combine high-performance commercial microelectronics with radiation-hardening capabilities, enabling Department of War and space systems to operate reliably in radiation-intensive environments while maintaining cutting-edge processing performance.
This summary is AI-generated from the official solicitation.
Key Details
Official Description
The performance and survivability of Department of War (DoW) and space systems, especially those operating in space environments, are critically affected by radiation. Radiation testing of parts is a major cost and schedule driver for DoW and space systems. The market for microelectronics that meet government radiation requirements is small. Commercial microelectronics could meet the government’s performance requirements while failing to meet its natural space requirements. Some state-of-the-art...
Change History
Radiation Hardening of Non-Hardened Commercial Microelectronics
Status changed from Open to Closed after topic disappearance
Radiation Hardening of Non-Hardened Commercial Microelectronics
This Q&A clarifies that applicants cannot use shielding, 3D printing, or custom enclosures as solutions, but may pursue system-level optimization of packaging and interfaces; historical radiation data is acceptable for Phase I, and autonomous detect-and-recover SEL protection satisfies immunity requirements without requiring latch-up-free design.
Radiation Hardening of Non-Hardened Commercial Microelectronics
Status changed from Pre-Release to Open
Radiation Hardening of Non-Hardened Commercial Microelectronics
New opportunity: Radiation Hardening of Non-Hardened Commercial Microelectronics
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