This solicitation closed on August 19, 2026

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MDA26BZ04-NV002ClosedSBIR

Radiation Hardening of Non-Hardened Commercial Microelectronics

Department of DefenseMDA

AI Overview

This RFP seeks advanced packaging techniques to combine high-performance commercial microelectronics with radiation-hardening capabilities, enabling Department of War and space systems to operate reliably in radiation-intensive environments while maintaining cutting-edge processing performance.

This summary is AI-generated from the official solicitation.

Key Details

Agency
Department of Defense
Funding Amount
Release Date
July 1, 2026
Due Date
August 19, 2026 (Closed)

Official Description

The performance and survivability of Department of War (DoW) and space systems, especially those operating in space environments, are critically affected by radiation. Radiation testing of parts is a major cost and schedule driver for DoW and space systems. The market for microelectronics that meet government radiation requirements is small. Commercial microelectronics could meet the government’s performance requirements while failing to meet its natural space requirements. Some state-of-the-art...

View on official source

Change History

Status ChangedAug 19, 2026 at 4:01 PM

Radiation Hardening of Non-Hardened Commercial Microelectronics

Status changed from Open to Closed after topic disappearance

Q&A UpdatedAug 4, 2026 at 5:01 PM

Radiation Hardening of Non-Hardened Commercial Microelectronics

This Q&A clarifies that applicants cannot use shielding, 3D printing, or custom enclosures as solutions, but may pursue system-level optimization of packaging and interfaces; historical radiation data is acceptable for Phase I, and autonomous detect-and-recover SEL protection satisfies immunity requirements without requiring latch-up-free design.

Status ChangedJul 22, 2026 at 1:03 PM

Radiation Hardening of Non-Hardened Commercial Microelectronics

Status changed from Pre-Release to Open

Opportunity AddedJul 1, 2026 at 12:02 PM

Radiation Hardening of Non-Hardened Commercial Microelectronics

New opportunity: Radiation Hardening of Non-Hardened Commercial Microelectronics

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