Radiation Hardening of Non-Hardened Commercial Microelectronics
AI Overview
This RFP seeks advanced packaging techniques to combine high-performance commercial microelectronics with radiation-hardening capabilities, enabling Department of War and space systems to operate reliably in radiation-intensive environments while maintaining cutting-edge processing performance.
This summary is AI-generated from the official solicitation.
Key Details
Official Description
The performance and survivability of Department of War (DoW) and space systems, especially those operating in space environments, are critically affected by radiation. Radiation testing of parts is a major cost and schedule driver for DoW and space systems. The market for microelectronics that meet government radiation requirements is small. Commercial microelectronics could meet the government’s performance requirements while failing to meet its natural space requirements. Some state-of-the-art...
Change History
Radiation Hardening of Non-Hardened Commercial Microelectronics
New opportunity: Radiation Hardening of Non-Hardened Commercial Microelectronics
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