Photonic-electronic Panels Integration (PEPI)
AI Overview
This SBIR seeks development of photonic-electronic integration panels that combine optical and electrical routing for multi-chip systems, addressing the need for high-density, low-cost interconnect solutions beyond current chip-to-chip capabilities. The solution must demonstrate manufacturable 3D optical routing with integrated fiber interfaces and meet specified optical link performance metrics.
This summary is AI-generated from the official solicitation.
Key Details
Official Description
The HAPPI program is developing three-dimensional chip-to-chip and intra-chip optical routing that are compatible with standard microelectronics manufacturing processes. The program scope includes multiple routing planes within a photonic integrated circuit (PIC) or photonic interposer, connections between routing layers capable of traversing substrate thickness, and surface methods for coupling light from one photonic chip to another. This technology will enable packages that include multiple P...
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