In-Situ Metrology for Mesa-Wall Integrity in Large Format Small-Pixel Infrared Detector Array Fabrication
AI Overview
This RFP seeks non-destructive metrology solutions to assess mesa-wall surface integrity in advanced infrared detector arrays during fabrication. The technology must detect surface defects in small-pixel geometries for Sb-based and MCT detectors across MWIR/LWIR bands, enabling real-time process optimization and higher-yield production for military sensor platforms.
This summary is AI-generated from the official solicitation.
Key Details
Official Description
The Department of War has a rapidly increasing demand for large-format, small-pixel FPAs to support advanced sensor platforms across Ground, air, maritime, and space domains. To keep pace with ongoing advancements in C-MOS digital-in-pixel Read-Out Integrated Circuits (ROICs) and to produce next-generation infrared sensors, fabrication processes must consistently yield exceptionally high-quality detector arrays. This demand is particularly relevant for high-performance materials such as Antimony...
Change History
In-Situ Metrology for Mesa-Wall Integrity in Large Format Small-Pixel Infrared Detector Array Fabrication
New opportunity: In-Situ Metrology for Mesa-Wall Integrity in Large Format Small-Pixel Infrared Detector Array Fabrication
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