Additive Manufacturing for Flexible Electronics
AI Overview
This RFP seeks to validate additive manufacturing technologies for flexible electronics and advanced packaging to reduce costs and lead times in high-mix, low-volume production. The effort aims to establish reliability data for 3D-printed substrates and interconnects as viable alternatives to traditional manufacturing methods for Department of War microelectronic systems.
This summary is AI-generated from the official solicitation.
Key Details
Official Description
Additive manufacturing, also referred to as 3D printing, has seen innovation in several critical areas in the field of electronics packaging and assembly from wafer level to printed circuit boards for low volume manufacturing and prototyping. Ceramic interposers are being manufactured using vat photopolymerization technologies to create substrates with channels for interconnects, that are backfilled through the process of metal infiltrations [1] The unique geometries enabled by the layer-to-laye...
Change History
Additive Manufacturing for Flexible Electronics
New opportunity: Additive Manufacturing for Flexible Electronics
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