3D-Heterogeneously Integrated Photonic (HIP) Imaging Sensor
AI Overview
This RFP seeks development of 3D heterogeneously integrated photonic imaging sensors that stack detector, readout electronics, and optical interconnect layers to overcome copper bandwidth limitations in advanced military EO/IR focal plane arrays. The solution enables concurrent wide field-of-view, high resolution, and ultra-high frame rate imaging through innovative vertical integration and cryogenic-compatible design.
This summary is AI-generated from the official solicitation.
Key Details
Official Description
Emerging military electro-optical and infrared (EO/IR) sensors enable high resolution through small pixels, wide field-of-view through large arrays, and high frame rate through high sensitivity and low latency. For the most advanced focal plane array (FPA) sensors, the data bandwidth dictated by the high pixel count and bit rate is reaching the limits of conventional copper wire interconnects. Datalinks using optical interconnects offer a unique and commercially mature solution that can obviate ...
More Department of Defense Opportunities
Get Alerts for Opportunities Like This
RallyProp monitors thousands of funding sources and sends instant alerts when opportunities match your technology and capabilities.
Start Free Trial